INDIANAPOLIS DEPARTMENT OF PUBLIC WORKS (INDY-DPW)
IUPUI-PURDUE SCHOOL OF ENGINEERING & TECHNOLOGY (IUPUI)
INDY – DPW / IUPUI NRP (NEW PRODUCT REVIEW) PROCESS REPORT
(A liquid additive for concrete and repair mortars for the prevention of
Microbiologically Induced Corrosion (MIC) in sanitary sewers)
ConShield has introduced a product that reduces Microbial Induced Corrosion (MIC). ConmicShield® is a water soluble additive that becomes an integral part of the concrete and impales the membrane of the Thiobacillus bacteria, stopping the chemical process that creates the concrete digesting Sulfuric Acid. The effects of this additive are still in the early phases of development.
This report details the successful testing through various agencies that has allowed limited field use of this product. Also presented within this report are past performances, a comparison between ConmicShield® and the applicable standards for the City of Indianapolis, the manufacturing process/locations, material characteristics, quality control measures, service life, product design and cost.
The IUPUI Department of Engineering Technology recommends the approval of ConmicShield® for tentative use. The location of ConmicShield® should be investigated and determined by the city, preferably, utilized in a manner that would allow for objective comparisons between structures with and without ConmicShield® or various other comparable products.
Based on the success of laboratory test results and the in-situ applications the IUPUI Department of Engineering Technology recommends the approval of ConmicShield® for tentative use for new and retrofit construction. Cast-in-place, precast, shotcrete, and ConShield’s permaform process in accordance with ConSheild’s suggested specifications (Appendix P) should deemed be an approved alternative.
The location of ConmicShield® should be investigated and determined by the city, where MIC is anticipated. Preferably the additive will be utilized in a manner that would allow for objective comparisons between structures with and without CONmicSHIELD.
Third party testing was not performed when compiling this report.